SILVER HYBRID COPPER POWDER, METHOD FOR PRODUCING SAME, CONDUCTIVE PASTE CONTAINING SILVER HYBRID COPPER POWDER, CONDUCTIVE ADHESIVE, CONDUCTIVE FILM AND ELECTRICAL CIRCUIT

摘要

The present invention, on the surface of the copper powder is attached a fine powder having a mean particle size of the copper powder (D. _50. ) And had an average particle diameter of the fine particles (D. _SEM. ) of non-(D. _50. / D. _SEM. ) is in the range of 3 to 400, and minutes and is characterized in that copper is in the range of 0.5 to 1.5 ratio of tap density of the fine particles hybrid copper powder, its manufacturing method, the relates to a conductive paste, conductive adhesive, a conductive film and an electrical circuit containing a hybrid copper powder . The hybrid copper powder of the present invention can be obtained, by using the copper fine particles having a specific branch of the average particle diameter and the tap density, the surface of copper powder and the copper powder particles in the fine particle powder are mixed and stirred by attaching a fine powder and conductive, electrically conductive, and migration within the castle is excellent.