SILVER HYBRID COPPER POWDER, METHOD FOR PRODUCING SAME, CONDUCTIVE PASTE CONTAINING SILVER HYBRID COPPER POWDER, CONDUCTIVE ADHESIVE, CONDUCTIVE FILM AND ELECTRICAL CIRCUIT

摘要

The present invention relates to a silver hybrid copper powder which is characterized in that: a fine silver particle powder adheres to the surface of a copper powder; the ratio of the average particle diameter (D₅₀) of the copper powder to the average particle diameter (D_SEM) of the fine silver particles, namely D₅₀/D_SEM is within the range of 3-400; and the tap density ratio of the copper powder to the fine silver particles is within the range of 0.5-1.5. The present invention also relates to: a method for producing the silver hybrid copper powder; a conductive paste which contains the silver hybrid copper powder; a conductive adhesive; a conductive film; and an electrical circuit. A silver hybrid copper powder of the present invention uses a copper powder and fine silver particles having specific average particle diameters and specific tap densities, and can be obtained by mixing and stirring the copper powder and fine silver particle powder, thereby having the fine silver particle powder adhere to the particle surfaces of the copper powder. This silver hybrid copper powder has excellent electrical conductivity and excellent migration resistance.