Study on the Electrical Property of Silver (Ag) Nanoparticles Filled Epoxy Composites for the Application of Electrically Conductive Adhesives (ECAs) in Electronic Packaging

摘要

The aim of the present work is to study the properties of silver nanoparticles-filled epoxy composites, as a function of filler loading (0 to 8 vol.%). As expected, the electrical conductivity of composites increases with filler loading. The insulator-to-conductor transition occurred at percolation threshold of 5 vol.% of nanosized-silver with the corresponding DC conductivity of 2.716×10{sup}(-3) S/cm. Further increment of filler amount does not help much in improving the conductivity of composites. The composites follow the trend of the expected behaviors predicted by standard percolation theory. The DC conductivity increases as power laws (σ{sub}(dc) = σ{sub}f(V{sub}f -^sV{sub}c)' for V{sub}f > V{sub}c, and σ{sub}(dc) = σ{sub}i(V{sub}c-V{sub}f){sup}(-s) for V{sub}c > V{sub}f) with filler concentration.