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机译:Sn晶体取向对低电流密度Cu / Ni镀层/Sn-0.7Cu接头中焊料电迁移和Ni扩散的影响
Electronic Components Production Engineering Division, Toyota Motor Corporation, Hirose Plant, 543, Kirigahora, Nishihirose-cho, Toyota, Aichi, Japan,The Institute of Scientific and Industrial Research, Osaka University, 8-1, Mihogaoka, Ibaraki, Osaka, Japan;
School of Engineering, Chukyo University, 101-2, Yagoto Honmachi, Showa, Nagoya, Aichi, Japan;
School of Engineering, Chukyo University, 101-2, Yagoto Honmachi, Showa, Nagoya, Aichi, Japan;
Power Electronics Development Division, Toyota Motor Corporation, 1, Toyota-cho, Toyota, Aichi, Japan;
School of Engineering, Chukyo University, 101-2, Yagoto Honmachi, Showa, Nagoya, Aichi, Japan;
The Institute of Scientific and Industrial Research, Osaka University, 8-1, Mihogaoka, Ibaraki, Osaka, Japan;
The Institute of Scientific and Industrial Research, Osaka University, 8-1, Mihogaoka, Ibaraki, Osaka, Japan;
机译:铜/镍镀层/复合Sn-0.7Cu焊料的高耐热接头,并添加了用于将芯片固定在功率模块中的铜球
机译:用Cu球添加Cu / Ni-P电镀/ SN-0.7CU焊料的高恒温接头
机译:临界电流密度,用于抑制Cu /焊料/ Ni接头的Ni侧的(Cu,Ni)_(6)Sn_(5)形成
机译:在低电流密度下Cu / Chilitalest Ni-P电镀/ SN-Cu的联合系统中的焊料电迁移行为
机译:利用实验室规模X射线计算机断层扫描技术对Sn-0.7Cu焊料中的电迁移过程进行量化。
机译:Ni对SN-0.7CU焊点SN晶须形成抑制的影响
机译:用SN / AG多电镀和Ni / Au涂层垫Cu芯焊球之间BGA关节的可焊性
机译:弹性微分有效截面和非弹性得到了44兆电子伏的释放颗粒αON TaRGET:为24mg,25毫克,26mG,40Ca,46Ti,48Ti,50Ti,52Cr,54Fe,的56Fe,58Fe,58Ni,60Ni,62NI,64Ni, 63Cu,65Cu,64Zn,112sn,114sn,116s