Cu-Ni-Sn Cu-Ni-Sn-BASED COPPER ALLOY FOIL WROUGHT COPPER ELECTRIC PARTS AND AUTO FOCUS CAMERA MODULE

摘要

Provided are a thin Cu-Ni-Sn based copper alloy foil, a copper rolled product, an electronic device part, and an autofocus camera module, wherein the thin Cu-Ni-Sn based copper alloy foil has improved solder wettability and improved solder adhesion strength, and can be suitably used as a conductive spring material for use in electronic device parts such as autofocus camera modules. According to the present invention, the Cu-Ni-Sn based copper alloy foil has a foil thickness of 0.1 mm or less, and contains from 14% by mass to 22% by mass of Ni, from 4% by mass to 10% by mass of Sn, and the remainder consisting of copper and inevitable impurities. Moreover, the Cu-Ni-Sn based copper alloy foil has a maximum height roughness (Rz) of from 0.1 μm to 1 μm on a surface in a direction parallel to a rolling direction.