首页> 外文学位 >Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys

【24h】

Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys

机译：铜钴合金和铜镍合金的电沉积以及铜钴合金的脉冲镀

获取原文

获取原文并翻译 | 示例

页面导航

著录项
相似文献
相关主题

著录项

作者
Wang, Shuisheng.;
展开▼
作者单位

Laurentian University (Canada).;

展开▼
授予单位 Laurentian University (Canada).;
学科 Inorganic chemistry.
学位 M.Sc.
年度 1989
页码 186 p.
总页数 186
原文格式 PDF
正文语种 eng
中图分类
关键词
入库时间 2022-08-17 11:54:39

相似文献

外文文献
中文文献
专利

1. Pulse-plating of copper-cobalt alloys [J] . P. E. Bradley, D. Landolt Electrochimica Acta . 1999,第7期

机译：脉冲电镀铜钴合金
2. Activities of phosphorus in copper-cobalt liquid alloys saturated with solid copper-cobalt solid solutions at 1573 K [J] . M. Hasegawa, Yoshiteru Kikuchi, M. Iwase Scandinavian Journal of Metallurgy . 2003,第6期

机译：1573 K下固-铜-钴固溶体饱和的铜-钴液态合金中磷的活度
3. Treatment of copper-cobalt alloy with molten magnesium for metal extraction [J] . Zhang Chunxi, Guo Xueyi, Yu Dawei, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2021,第1期

机译：用熔融镁对金属提取处理铜 - 钴合金
4. Transformation Kinetics and Mechanical Properties of Copper-Alloyed and Copper-Nickel Alloyed ADI [C] . Marcin Górny, Edward Tyrata, Gabriela Sikora International Symposium on the Science and Processing of Cast Iron . 2018

机译：铜合金和铜镍合金Adi的转化动力学和力学性能
5. Effect of alloying elements on the corrosion behaviour of copper-nickel alloys in a marine environment. [D] . Taher, Abulmaali M. Y. 2008

机译：合金元素对海洋环境中铜镍合金腐蚀行为的影响。
6. Graphene-Reinforced Zn–Ni Alloy Composite Coatingon Iron Substrates by Pulsed Reverse Electrodeposition and Its HighCorrosion Resistance [O] . Sishi Li, Gongsheng Song, Yupeng Zhang, 2021

机译：石墨烯增强Zn-Ni合金复合涂料脉冲反向电沉积的铁基材及其高电平耐腐蚀性能
7. The Electrodeposition of Copper-Cobalt Alloys [O] . Dunn Richard L. 1944

机译：铜钴合金的电沉积
8. Chromium/Molybdenum Alloy Plating. Part 1: The Electrodeposition of Low Contraction Chromium/Molybdenum Alloys Using Unipolar (On/Off) Pulse Plating. [R] . Miller, M. D., Langston, S. 1994

机译：铬/钼合金电镀。第1部分：使用单极（开/关）脉冲电镀电沉积低收缩铬/钼合金。

Electrodeposition of copper-cobalt alloys and copper-nickel alloys and pulse plating of copper-cobalt alloys

著录项

相似文献

相关主题

期刊订阅