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Solid-state Reactions And Stress Evolutions Between Snag And Ni(p) Thin Films

机译:Snag和Ni(p)薄膜之间的固相反应和应力演化

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摘要

Phase transformations in SnAg-Ni_(80)P_(20) films were studied ex situ in parallel with in situ measurements of the corresponding transformation-induced stresses. Layered formation of Ni_3Sn_4 and Ni_3P phases at an early stage of a reaction between SnAg and Ni_(80)P_(20) films resulted in a tensile stress similar to the stress evolution in Sn-Ni_(80)P_(20) films, despite the additional formation of Ag_3Sn phase. Ag_3Sn phase did not significantly affect the degree of stress evolution because of its islandlike and sporadic formation on the top surface of the Ni_3Sn_4 layer. Isothermal annealing showed that compressive stress, which was induced by the dominant formation of Ni_3Sn_4, developed after an initial evolution of tensile stress.
机译:SnAg-Ni_(80)P_(20)薄膜中的相变是在原位研究的,同时对相应的相变诱导应力进行了原位测量。尽管SnAg和Ni_(80)P_(20)膜发生反应的早期阶段,Ni_3Sn_4和Ni_3P相的分层形成导致类似于Sn-Ni_(80)P_(20)膜中应力演变的拉伸应力。 Ag_3Sn相的额外形成。由于Ag_3Sn相在Ni_3Sn_4层的顶表面上呈岛状和零星的形成,因此不会显着影响应力演化的程度。等温退火表明,由Ni_3Sn_4的主要形成引起的压应力是在拉应力的初始演化后产生的。

著录项

  • 来源
    《Journal of Materials Research》 |2009年第2期|482-486|共5页
  • 作者

    Jae Yong Song; Jin Yu;

  • 作者单位
  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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