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A novel approach of using a MBE template for ALD growth of high-κ dielectrics

机译:使用MBE模板进行高κ电介质的ALD生长的新方法

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We have employed molecular beam epitaxy (MBE) to grow high κ dielectric nano-thick films of Al_2O_3 and HfO_2 on Si (100) as templates to suppress effectively the formation of the oxide/Si interfacial layer during the subsequent atomic layer deposition (ALD) growth for Al_2O_3. We show marked improvements of electrical performance of the ALD + MBE composite oxides. A first bi-layer composite of ALD Al_2O_3 1.9 nm/MBE Al_2O_3 1.4 nm showed a dielectric constant of 9.1 with an equivalent oxide thickness (EOT) of 1.41 nm. The interfacial trap density D_(it) was 2.2 x 10~(11) cm~(-2) eV~(-1) as deduced from the conductance method, with the leakage current density being 2.4 x 10~(-2) A/cm~2 at V_(fb) - 1 V. The second bi-layer of ALD Al_2O_3 3.0nm/MBE HfO_2 2.0nm showed a dielectric constant of 11.5 and an EOT of 1.7nm. The D_(it) was estimated to be 2 x 10~(11) cm~(-2) eV~(-1) with the leakage being 1.1 x 10~(-4) A/cm~2 at V_(fb) + 1 V.
机译:我们已采用分子束外延(MBE)在Si(100)上生长Al_2O_3和HfO_2的高κ介电纳米厚膜作为模板,以有效抑制随后的原子层沉积(ALD)过程中氧化物/ Si界面层的形成Al_2O_3的增长。我们显示出ALD + MBE复合氧化物的电气性能有了显着改善。 ALD Al_2O_3 1.9 nm / MBE Al_2O_3 1.4 nm的第一双层复合材料的介电常数为9.1,等效氧化物厚度(EOT)为1.41 nm。根据电导法推导,界面陷阱密度D_(it)为2.2 x 10〜(11)cm〜(-2)eV〜(-1),漏电流密度为2.4 x 10〜(-2)A在V_(fb)-1V时为/ cm〜2。ALD Al_2O_3 3.0nm / MBE HfO_2 2.0nm的第二双层表现出11.5的介电常数和1.7nm的EOT。 D_(it)估计为2 x 10〜(11)cm〜(-2)eV〜(-1),在V_(fb)处的泄漏为1.1 x 10〜(-4)A / cm〜2 + 1V。

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