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首页> 外文期刊>Journal of Applied Physics >Low‐Density Injected Plasma in p‐Type Indium Antimonide
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Low‐Density Injected Plasma in p‐Type Indium Antimonide

机译:p型锑化铟中的低密度注入等离子体

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Properties of low‐density injected plasma in p‐InSb have been studied. Measurements have been made on n+‐p‐p+ diodes biased in the forward direction at 77°K. The time dependent behavior of the I‐V characteristics has been measured by application of dc pulses, with and without a transverse magnetic field present. At short periods after applying the pulses, or at low injection levels, the current is carried mainly by holes in the major part of the sample. At long periods after applying the pulses and at high injection levels the shape of the I‐V characteristics is governed by the injected plasma, and a steady state is reached within about 10 μsec. In a transverse magnetic field the plasma is deflected by the Suhl effect towards the surface. There the electrons and holes recombine at a high rate. This mechanism reduces the number of carriers which contribute to conduction. At a magnetic field of about 300 G the I‐V curves have a similar shape as the ones measured at a short period after applying the pulse. Trapping and recombination mechanisms which are very important for a low‐density plasma in p‐type InSb have been studied by measuring the conductivity modulation after the end of the injecting pulse. The occurrence of an S‐shaped I‐V characteristic is due to the filling of the traps with injected electrons. The measurement of the conductivity modulation in connection with fourpoint probe measurements show that already at low currents, below the NDR region, traps are filled within a small channel. Its cross section decreases with increasing distance from the injecting contact. With increasing current the channel grows and reaches a maximum of about half of the sample cross section in the region above negative differential resistivity.
机译:研究了p-InSb中低密度注入等离子体的特性。在正向偏置在77°K的n + -p-p +二极管上进行了测量。 I-V特性随时间的行为已通过施加直流脉冲(有无横向磁场)进行了测量。在施加脉冲后的短时间内,或在低注入水平下,电流主要由样品主体中的孔承载。在施加脉冲后的较长时间和高注入水平下,IV特性的形状由注入的等离子体控制,并且在约10微秒内达到稳定状态。在横向磁场中,等离子体通过苏尔效应向表面偏转。在那里,电子和空穴以高速率复合。这种机制减少了有助于传导的载流子的数量。在大约300 G的磁场下,IV曲线的形状类似于施加脉冲后短时间内测得的形状。通过测量注入脉冲结束后的电导率调制,已经研究了对于p型InSb中的低密度等离子体非常重要的捕获和重组机制。 S型I-V特性的出现是由于陷阱中注入了电子。与四点探针测量结合的电导率调制测量表明,在低电流下,在NDR区域以下,陷阱已填充在一个小通道内。其横截面随着与注入触点的距离增加而减小。随着电流的增加,通道在负微分电阻率上方的区域中增长并达到最大约一半的样品横截面。

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  • 来源
    《Journal of Applied Physics 》 |1970年第1期| 共7页
  • 作者单位

    Angewandte Physik der Universität, 1090 Vienna, AustriaLudwig Boltzmann Institut f&xfcr;

    Festkör per physik, Vienna, Austria;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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