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机译:用于100μm间距应用的Cu / SnAg双凸块倒装芯片组件的热循环可靠性
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1, Guseong-dong, Yuseong-gu, Daejeon 305-701, South Korea;
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1, Guseong-dong, Yuseong-gu, Daejeon 305-701, South Korea;
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1, Guseong-dong, Yuseong-gu, Daejeon 305-701, South Korea;
Nepes Corporation 654-2, Gak-ri, Ochang-myun, Cheongwon-gun, Chungchungbuk-do 363-883, South Korea;
Nepes Corporation 654-2, Gak-ri, Ochang-myun, Cheongwon-gun, Chungchungbuk-do 363-883, South Korea;
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 373-1, Guseong-dong, Yuseong-gu, Daejeon 305-701, South Korea;
机译:非导电膜的热力学性能对40-
机译:有机衬底上Cu / SnAg双凸块倒装芯片组件的热可靠性研究
机译:有机衬底上Cu / SnAg双凸块倒装芯片组件的热可靠性研究
机译:用于100um间距应用的Cu / SnAg双凸块倒装芯片组件的热循环可靠性
机译:在环境和电源循环测试期间进行倒装芯片组装的过程应力分析和可靠性评估。
机译:晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
机译:用于siF应用的细间距超薄芯片的倒装芯片焊接
机译:薄基板,精细凸块间距和小型原型模具的倒装芯片组装。