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首页> 外文期刊>Journal of Applied Physics >The influence of the AlN barrier thickness on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors
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The influence of the AlN barrier thickness on the polarization Coulomb field scattering in AlN/GaN heterostructure field-effect transistors

机译:AlN势垒厚度对AlN / GaN异质结构场效应晶体管中极化库仑场散射的影响

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摘要

The electron mobility scattering mechanisms in AlN/GaN heterostuctures with 3 nm and 6 nm AlN barrier thicknesses were investigated by temperature-dependent Hall measurements. The effect of interface roughness (IFR) scattering on the electron mobility was found to be enhanced by increasing AlN barrier thickness. Moreover, using the measured capacitance-voltage and current-voltage characteristics of the fabricated heterostructure field-effect transistors (HFETs) with different Schottky areas on the two heterostuctures, the variations of electron mobility with different gate biases were investigated. Due to enhanced IFR scattering, the influence of polarization Coulomb field (PCF) scattering on electron mobility was found to decrease with increasing AlN barrier layer thickness. However, the PCF scattering remained an important scattering mechanism in the AlN/GaN HFETs.
机译:通过与温度相关的霍尔测量,研究了AlN / GaN异质结构中AlN势垒厚度为3 nm和6 nm的电子迁移率散射机理。发现通过增加AlN势垒厚度可以增强界面粗糙度(IFR)散射对电子迁移率的影响。此外,利用所测量的在两个异质结上具有不同肖特基面积的异质结场效应晶体管(HFET)的电容-电压和电流-电压特性,研究了不同栅极偏置下电子迁移率的变化。由于增强了IFR散射,发现极化库仑场(PCF)散射对电子迁移率的影响随AlN势垒层厚度的增加而减小。然而,PCF散射仍然是AlN / GaN HFET中的重要散射机制。

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  • 来源
    《Journal of Applied Physics》 |2014年第2期|024504.1-024504.5|共5页
  • 作者单位

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

    School of Physics, Shandong University, Jinan 250100, China;

    School of Physics, Shandong University, Jinan 250100, China;

    School of Physics, Shandong University, Jinan 250100, China;

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

    National Key Laboratory of Application Specific Integrated Circuit (ASIC), Hebei Semiconductor Research Institute, Shijiazhuang 050051, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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