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Growth and electrical properties of in situ Sb-doped Ge_(1-x)Sn_x epitaxial layers for source/drain stressor of strained-Ge transistors

机译:应变Ge晶体管的源/漏应力源Sb掺杂Ge_(1-x)Sn_x外延层的生长和电性能

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We have investigated the thermal stability of heavily Sb-doped n(+)-Ge and n(+)-Ge0.94Sn0.06 epitaxial layers grown on a Ge substrate by annealing up to a temperature of 400 degrees C. The Ge0.94Sn0.06 sample with a Sb concentration higher than 10(20)cm(-3) retained superior crystallinity and a smooth surface even after annealing. It also maintained an electron concentration higher than the solid solubility of Sb and the highest substitutional Sb concentration after 400 degrees C annealing. We found the possibility of a low-contact-resistivity device employing Ge(0.94)Sn(0.04)with a high electron concentration and a metal with an electrode fabrication temperature lower than 400 degrees C. (C) 2018 The Japan Society of Applied Physics
机译:我们已经研究了通过退火至400摄氏度的温度在Ge衬底上生长的重掺杂Sb的n(+)-Ge和n(+)-Ge0.94Sn0.06外延层的热稳定性。Ge0.94Sn0 Sb浓度高于10(20)cm(-3)的.06样品即使在退火后仍保持优异的结晶度和光滑的表面。在400℃退火之后,它还保持高于Sb的固溶度和最高取代Sb浓度的电子浓度。我们发现了采用具有高电子浓度的Ge(0.94)Sn(0.04)和电极制造温度低于400摄氏度的金属的低接触电阻率器件的可能性。(C)2018年日本应用物理学会

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