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首页> 外文期刊>Applied physics express >Reconstruction of Latent Images from Dose-Pitch Matrices of Line Width and Edge Roughness of Chemically Amplified Resist for Extreme Ultraviolet Lithography
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Reconstruction of Latent Images from Dose-Pitch Matrices of Line Width and Edge Roughness of Chemically Amplified Resist for Extreme Ultraviolet Lithography

机译:从极紫外光刻技术的化学放大抗蚀剂的线宽和边缘粗糙度的剂量-间距矩阵重建潜像

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摘要

The line width and line edge roughness (LER) of resist patterns are related to the concentration and its gradient of chemical compounds that determine the solubility of the resist, respectively. Therefore, latent images can be obtained from the line width and LER of resist patterns. In this study, two-dimensional (exposure dose and half-pitch) matrices of resist line width and LER were analyzed on the basis of the sensitization mechanisms of chemically amplified resists used for extreme ultraviolet (EUV) lithography. In the reconstruction of latent images, the effective reaction radius for catalytic chain reaction is an important parameter. The probable range of effective reaction radius was from 0.05 to 0.2 nm. In this range, latent images were successfully reconstructed. The finding that the effective reaction radius is smaller than the typical size of a counteranion suggests that the resist performance can be improved by increasing the effective reaction radius.
机译:抗蚀剂图案的线宽和线边缘粗糙度(LER)分别与确定抗蚀剂溶解度的化合物的浓度及其梯度有关。因此,可以从抗蚀剂图案的线宽和LER获得潜像。在这项研究中,基于用于极端紫外线(EUV)光刻的化学放大抗蚀剂的敏化机理,分析了抗蚀剂线宽和LER的二维矩阵(曝光剂量和半间距)。在潜像重建中,催化链反应的有效反应半径是重要的参数。有效反应半径的可能范围是0.05至0.2nm。在此范围内,成功重建了潜像。有效反应半径小于抗衡阴离子的典型尺寸的发现表明,可以通过增加有效反应半径来改善抗蚀剂性能。

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  • 来源
    《Applied physics express》 |2010年第6issue1期|P.066504.1-066504.6|共6页
  • 作者单位

    The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;

    Semiconductor Leading Edge Technologies, Inc. (Selete), 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan;

    Semiconductor Leading Edge Technologies, Inc. (Selete), 16-1 Onogawa, Tsukuba, Ibaraki 305-8569, Japan;

    The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan;

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