首页> 外文会议>Conference on advances in resist materials and processing technology XXVIII >Analysis of Resist Patterns for Material and Process Design-Parameter Extraction from Dose-Pitch Matrices of Line Width and Edge Roughness and Cross-Sectional SEM Images
【24h】

Analysis of Resist Patterns for Material and Process Design-Parameter Extraction from Dose-Pitch Matrices of Line Width and Edge Roughness and Cross-Sectional SEM Images

机译:从线宽和边缘粗糙度的剂量-间距矩阵以及截面SEM图像中提取材料和工艺设计参数的抗蚀剂图案的分析

获取原文

摘要

The chemical reactions induced in chemically amplified resists using a molecular glass resist (the seventh Selete Standard Resist, SSR7) were investigated. Two-dimensional (half-pitch and exposure dose) matrices of resist line width and line edge roughness (LER) and the remaining resist thickness were analyzed on the basis of the sensitization mechanisms of chemically amplified resists for extreme ultraviolet (EUV) lithography. The line width, LER, and remaining resist thickness were successfully reproduced by assuming that LER is inversely proportional to the chemical gradient. The chemistry of SSR7 was discussed.
机译:研究了使用分子玻璃抗蚀剂(第七Selete标准抗蚀剂,SSR7)在化学放大抗蚀剂中引起的化学反应。基于化学放大光刻胶对超紫外光刻的敏化机理,分析了光刻胶线宽和线边缘粗糙度(LER)的二维(半间距和曝光剂量)矩阵以及剩余的光刻胶厚度。通过假定LER与化学梯度成反比,可以成功地复制线宽,LER和剩余的抗蚀剂厚度。讨论了SSR7的化学性质。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号