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Homoepitaxial growth and investigation of stacking faults of 4H-SiC C-face epitaxial layers with a 1 degrees off-angle

机译:倾斜角为1度的4H-SiC C面外延层的同质外延生长和堆垛层错研究

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We grew epitaxial layers on 4H-SiC C-face substrates with a 1 degrees off-angle, and discussed important factors related to stacking fault ( SF) density reduction by investigating the causes of SFs. Three types of SFs were generated, namely 3C inclusions, 8H-SFs and (3, 5)-SFs. The 3C inclusions were caused by 3C-SiC particles, which were present on the substrates before epitaxial growth, or which had fallen onto the substrates during epitaxial growth from the inside walls of a chemical vapor deposition reactor. The 3C-inclusion density decreased when the in-situ H-2 etching depth exceeded 0.4 mu m because the 3C-SiC particles, which were present on substrates before epitaxial growth, were removed. For 8H-SFs and (3,5)-SFs, high dislocation density areas on the substrates rather than the dislocations themselves cause these SFs. To reduce the density of these SFs, it is important to suppress generation of the high dislocation density areas on the substrates. (C) 2015 The Japan Society of Applied Physics
机译:我们在4H-SiC C面衬底上以1度的偏角生长了外延层,并通过研究SF的原因来讨论了与堆叠缺陷(SF)密度降低相关的重要因素。生成了三种类型的SF,即3C夹杂物,8H-SF和(3,5)-SF。 3C夹杂物是由3C-SiC颗粒引起的,这些颗粒在外延生长之前存在于基板上,或者在外延生长期间从化学气相沉积反应器的内壁掉落到基板上。当原位H-2蚀刻深度超过0.4μm时,由于去除了在外延生长之前存在于基板上的3C-SiC颗粒,因此3C夹杂物密度降低。对于8H-SF和(3,5)-SF,基板上的高位错密度区域而不是位错本身会导致这些SF。为了降低这些SF的密度,重要的是抑制基板上高位错密度区域的产生。 (C)2015年日本应用物理学会

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