首页> 外国专利> FABRICATION OF TEMPLATES FOR HIGH-QUALITY GROUP 3 NITRIDE-BASED HOMOEPITAXIAL SUBSTRATE AND ITS RELATED LIGHT-EMITTING MULTISTRUCTURE AND GROWTH OF 3 NITRIDE-BASED EPITAXIAL SEMICONDUCTOR THIN FILM USING TEMPLATES

FABRICATION OF TEMPLATES FOR HIGH-QUALITY GROUP 3 NITRIDE-BASED HOMOEPITAXIAL SUBSTRATE AND ITS RELATED LIGHT-EMITTING MULTISTRUCTURE AND GROWTH OF 3 NITRIDE-BASED EPITAXIAL SEMICONDUCTOR THIN FILM USING TEMPLATES

机译:基于模板的高品质3族氮化物同质底物的模板制备及其相关的光散射多结构和生长

摘要

A homoepitaxial substrate for high-quality group 3 nitride-based epitaxial semiconductor thin film growth, and fabrication and growth of templates for homoepitaxial substrate and light-emitting multistructure are provided to dissipate heat generated during drive of a nitride-based semiconductor device readily. Fabrication of templates for high-quality group 3 nitride-based homoepitaxial substrate includes a one-step bonding process and a two-step bonding process. The one-step bonding process includes the steps of growing gallium nitride or aluminum nitride at a temperature of 700 degrees of centigrade or less using a metalorganic chemical vapor deposition, and depositing/growing a 3 nitride-based epitaxial semiconductor thin film on an Al2O3 growth substrate(110) using a high temperature buffer layer(130) at a temperature of 900 degrees of centigrade or more.
机译:提供用于高质量第3族氮化物基外延半导体薄膜生长的同质外延衬底,以及用于同质外延衬底和发光多结构的模板的制造和生长,以容易地驱散在氮化物基半导体器件的驱动期间产生的热量。用于高质量的基于3族氮化物的同质外延衬底的模板的制造包括一步骤键合工艺和两步骤键合工艺。一步结合工艺包括以下步骤:使用金属有机化学气相沉积法在700摄氏度或更低的温度下生长氮化镓或氮化铝,并在Al2O3上生长/沉积3氮化物基外延半导体薄膜。在900摄氏度或更高的温度下使用高温缓冲层(130)制作基板(110)。

著录项

  • 公开/公告号KR20070100851A

    专利类型

  • 公开/公告日2007-10-12

    原文格式PDF

  • 申请/专利权人 OH IN MO;

    申请/专利号KR20060032130

  • 发明设计人 OH IN MO;

    申请日2006-04-09

  • 分类号H01L33;

  • 国家 KR

  • 入库时间 2022-08-21 20:33:26

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