首页> 外文会议>Conference on Silicon Carbide and Related Materials >Conversion of basal plane dislocations to threading edge dislocations in growth of epitaxial layers on 4H-SiC substrates with a vicinal off-angle
【24h】

Conversion of basal plane dislocations to threading edge dislocations in growth of epitaxial layers on 4H-SiC substrates with a vicinal off-angle

机译:基于平面脱位转化为带有邻近偏角的4H-SiC基板上外延层的螺纹边缘位错

获取原文

摘要

We have investigated a conversion of basal plane dislocation (BPD) to threading edge dislocation (TED) in growth of epitaxial layers (epi-layers) on 4H-SiC vicinal substrates with an off-angle of 0.85° at low C/Si ratio of 0.7 by using deep KOH etching and X-ray topography observations. Deep KOH etching indicated that BPDs in the substrates converted to TEDs in the epi-layers. X-ray topography observations suggested that the conversion occurred during epitaxial growth when the thickness of epi-layers was less than 1.5 μm. We found that the conversion ratio obtained from counting deep KOH etch pits was over 99%.
机译:我们已经研究了基础平面位错(BPD)的转化为在4H-SiC邻位基板上的外延层(外延层)的生长中的螺纹边缘位错(TED),其在低C / Si比下以0.85°的偏角0.7通过使用深酸蚀刻和X射线形貌观察。深酸蚀刻表明基板中的BPD转换成截止板中的TED。 X射线地形观察表明,当外延层的厚度小于1.5μm时,在外延生长期间发生转化。我们发现,从计数深酸蚀刻坑获得的转化率超过99%。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号