Gold Ribbon Bonding for Microelectronic Interconnection: A Designed Experiment to Evaluate Process Opportunities

摘要

This paper presents results from a Design of Experiments (DOE) study undertaken to evaluate the feasibility of this study included the following: Establishing the viability of using a manual wire bonder to make gold ribbon bonds. Determining preliminary equipment process parameters for making robust and consistent ribbon bonds. Investigating the effect of different ribbon types on these process parameters and the resulting bonds. Establishing limits on the resultant interconnection geometries that can be achieved using this process. Determining whether aging affects ribbon bond pull strength.