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首页> 外文期刊>International Journal of Fatigue >Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy
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Low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy

机译：共晶80Au / 20Sn焊料合金的低周疲劳行为

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摘要

The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/ 20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/ 20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder.
机译：共晶80Au / 20Sn焊料合金广泛用于大功率电子产品和光电包装。在这项研究中，据报道共晶80Au / 20Sn焊料合金的低周疲劳行为。 80Au / 20Sn焊料在高应变速率下表现出准静态断裂特性，然后随着温度的升高，在低应变速率下逐渐从穿晶断裂（以疲劳损伤为主）转变为晶间断裂（以蠕变损伤为主）。提出了Coffin-Manson和Morrow模型来评估80Au / 20Sn焊料的低周疲劳行为。此外，与63Sn / 37Pb焊料相比，80Au / 20Sn焊料具有更高的抗疲劳性。

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  • 来源
    《International Journal of Fatigue》 |2015年第6期|100-107|共8页
  • 作者

    H.Y. Jing; Y.Y. Zhang; L.Y. Xu; G.S. Zhang; Y.D. Han; J. Wei;

  • 作者单位

    School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China,Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China;

    School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China,Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China;

    School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China,Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China;

    School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China,Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China;

    School of Materials Science and Engineering, Tianjin University, Tianjin 300072, China,Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300072, China;

    Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore 638075, Singapore;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Eutectic 80Au/20Sn solder alloy; Low cycle fatigue; Coffin-Manson model; Morrow model; Failure mechanism;

    机译：共晶80Au / 20Sn焊料合金;低周疲劳;棺材-曼森模型;明天模型;失败机制;

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