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Thermal fatigue resistant low-melting point solder alloys
Thermal fatigue resistant low-melting point solder alloys
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机译:抗热疲劳的低熔点焊料合金
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摘要
This invention provides a thermal fatigue resistant, low- melting point solder alloy consisting of 13 to 20% by weight Bi, 42 to 50% by weight, Pb, the balance being Sn. This solder alloy is suited for lap joints of electronic parts into or onto a printed substrate or a hybrid substrate.
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