机译:主动热成像技术和
School of Mechanical Engineering, Jiangsu Normal University, Xuzhou, China;
School of Mechanical Engineering, Jiangsu Normal University, Xuzhou, China;
Jiangnan University, Wuxi, China;
School of Mechanical Engineering, Jiangsu Normal University, Xuzhou, China;
School of Mechanical Engineering, Jiangsu Normal University, Xuzhou, China;
State Key Laboratory of Digital Manufacturing Equipment and Technology, Wuhan, China;
State Key Laboratory of Digital Manufacturing Equipment and Technology, Wuhan, China;
Inspection; Electronic packaging thermal management; Laser excitation; Clustering algorithms; Substrates; Temperature measurement; Flip-chip devices;
机译:球磨LaCo 5-
机译:用于检测塑料球栅阵列组件上隐藏的焊球缺陷的非侵入式主动红外热成像技术的评估
机译:<![CDATA [
机译:利用
机译:低温SNBI焊膏的工艺,强度和微观结构分析混合无铅焊球
机译:基于涡流脉冲热成像技术的锡球缺陷检测研究
机译:来自巴西东北部巴伊亚州的