Microsystem technology components sealed with active solder, components for them and solder transfer processes for their manufacture

摘要

Component component in the form of a substrate (13; 13 ') or a cap (4; 4') for an individual component or for a group of connected components intended for later isolation, comprising at least one completely circumferential raised component intended for later sealing Frame as an integral component, which at least in its superficial area (5) consists of a material selected from metals, metal alloys, metal and semi-metal compounds containing oxygen, nitrogen and / or carbon, and semiconductors, and its width from the Inside to outside of the frame is measured in the range from 80 µm to 500 µm, characterized in that the frame is completely covered with an active solder material (7) with a melting point of <450 ° C, the active solder being a solder metal or is a solder alloy, the / the at least one metal selected from the metals of the IV. and V subgroup and at least one metal , selected from lanthanum and the lanthanides.