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首页> 外文期刊>Semiconductor Manufacturing, IEEE Transactions on >Improved Characterization Methodology of Gate-Bulk Leakage and Capacitance for Ultrathin Oxide Partially Depleted SOI Floating-Body CMOS
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Improved Characterization Methodology of Gate-Bulk Leakage and Capacitance for Ultrathin Oxide Partially Depleted SOI Floating-Body CMOS

机译:超薄氧化物部分耗尽SOI浮体CMOS的栅-体泄漏和电容的改进的表征方法

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摘要

Device scaling of partially depleted (PD) silicon-on-insulator (SOI) has the potential to increase speed. However, the increased gate tunneling and capacitance will complicate device behaviors and increase the difficulty in characterization for modeling purpose. For the first time, gate-bulk leakage current Igb and gate capacitance Cgg characterization methodology for PD SOI floating-body (FB) CMOS with high accuracy is proposed and verified in 40-nm SOI devices. These devices are with ultrathin equivalent oxide thickness of 12Å, and radio frequency-capacitance voltage (RF-CV) technique is used for Cgg measurement to overcome the impact of leaky gate current. This methodology can eliminate properly the parasitic elements due to the coexistence of opposite poly gate type in the SOI T-shape body-tied device and accurately characterize and model Igb and Cgg behaviors for the PD SOI FB devices. Test patterns are designed with RF ground-signal-ground configuration and same test patterns can be used for both Igb and Cgg characterization. Impact of Igb and Cgg changes on the history effect, and speed and body potential is analyzed by BSIMSOI4.0 models. Simulation accuracy of history effect will have at least 3% improvement with this proposed methodology.
机译:部分耗尽(PD)的绝缘体上硅(SOI)的器件规模化有可能提高速度。然而,增加的栅极隧穿和电容将使器件的行为复杂化,并增加用于建模目的的表征难度。首次提出并验证了PD SOI浮体(FB)CMOS栅极栅漏电流I gb 和栅电容C gg 的表征方法。在40纳米SOI器件中。这些器件的等效氧化物厚度超薄,为12Aµ,并且射频电容电压(RF-CV)技术用于C gg 测量,以克服漏栅极电流的影响。这种方法可以适当地消除SOI T型体绑装置中由于相反多晶硅栅极类型的共存而产生的寄生元素,并可以准确地表征和建模I gb 和C gg PD SOI FB设备的行为。测试图案采用RF接地-信号-接地配置设计,相同的测试图案可用于I gb 和C gg 表征。 I gb 和C gg 变化对历史效应的影响,并通过BSIMSOI4.0模型分析了速度和体势。使用此提议的方法,历史效果的模拟精度将至少提高3%。

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