Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines

摘要

An integral equation-based quasi-static method is described for calculating the capacitance of multilayer board via's. The considered via geometry contains connecting strips, pads on the via, and a finite ground plane thickness. After showing that coupling through ground plane openings is very small for realistic configurations, via's are treated as a number of independent sections (one section per multiboard layer). The influence of the geometric parameters on the via capacitance is examined; results are also compared with previous publications and with measurements.