Introduction to the Special Issue on Failure Analysis of Integrated Circuit Devices and Packages

Goyal D.

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Introduction to the Special Issue on Failure Analysis of Integrated Circuit Devices and Packages

机译：集成电路器件和封装的故障分析专刊介绍

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The four articles in this special issue focus on failure analysis of integrated circuit devices and packages. The articles are briefly summarized here.

机译：本期特刊中的四篇文章集中于集成电路器件和封装的故障分析。文章在这里简要总结。

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《IEEE transactions on device and materials reliability》 |2007年第1期|p.3-4|共2页
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Goyal D.;
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中图分类电工技术;
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Introduction to the Special Issue on Failure Analysis of Integrated Circuit Devices and Packages

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