Method of failure analysis semiconductor integrated circuit, failure analysis equipment, and failure analysis program

摘要

PROBLEM TO BE SOLVED: To provide a method, apparatus and program for failure analysis of a semiconductor integrated circuit for accurately extracting an abnormal signal of the semiconductor integrated circuit obtained from a semiconductor inspection apparatus and a related circuit.;SOLUTION: The failure analysis method has: a signal detecting step of obtaining a coordinate of an apparatus coordinate system in an analysis data with regard to an abnormal signal data included in the analysis data of the semiconductor integrated circuit obtained from the semiconductor inspection apparatus; a coordinate converting step of obtaining a correspondence between the coordinate of the apparatus coordinate system and a coordinate of a design coordinate system in a design data of the semiconductor integrated circuit with regard to a plurality of reference points of the semiconductor integrated circuit, and obtaining a coordinate conversion equation between the apparatus coordinate system and the design coordinate system; an error calculating step of obtaining a position error between the coordinate of the apparatus coordinate system and the coordinate of the design coordinate system by the coordinate conversion equation; a circuit extracting step of extracting the circuit related to the abnormal signal in the design data from the coordinate of the abnormal signal in the apparatus coordinate system by using the coordinate conversion equation and the position error.;COPYRIGHT: (C)2010,JPO&INPIT