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Evaluation of Radiation Resiliency on Emerging Junctionless/Dopingless Devices and Circuits

机译:评价辐射弹性在新兴连接/多拔装置和电路上的辐射弹性

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The growing concern of single event upset (SEU) in sub-20 nm CMOS technology based field-effect transistors (FETs) has become a key challenge. Therefore, in this paper we have investigated performance degradation of digital benchmark circuits due to SEU for the conventional junctionless transistor (JLT) and dopingless JLT (DL-JLT). For device-circuit interaction, we have developed the lookup table based Verilog-A models of both devices. The circuit simulation results show that the critical linear energy transfer (LET) of DL-JLT based 6T SRAM cell is similar to 3.2x higher when compared to conventional JLT based 6T SRAM cell at V-DD = 0.9 V. The single event upset electrical masking efficiency of a five-stage inverter chain of FO1 (fan-out-one) based on DL-JLT exhibits significantly higher (similar to 33x) than its counterpart based design. Therefore, the results presented in this paper provide an opportunity for future digital logic bench mark circuits designing using DL-JLT for heavy ion irradiation environment.
机译:基于SUB-20 NM CMOS技术的场效应晶体管(FET)的单一事件令人不安(SEU)的越来越关注已成为关键挑战。因此,在本文中,我们对传统连接晶体管(JLT)和多卷绒JLT(DL-JLT)的SEU引起了数字基准电路的性能下降。对于设备电路交互,我们开发了基于查找表的Verilog-A模型。电路仿真结果表明,与V-DD = 0.9 V的传统的JLT的6T SRAM单元相比,基于DL-JLT的6T SRAM单元的临界线性能量传递(Let)类似于3.2倍。单一事件镦粗电气基于DL-JLT的FO1(扇出)的五级逆变器链的掩蔽效率显着更高(类似于33倍),而不是基于对应的设计。因此,本文提出的结果为使用DL-JLT进行了重型离子照射环境,为未来的数字逻辑台标标记电路提供了机会。

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