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A new grid-generation method for 2-D simulation of devices with nonplanar semiconductor surface

机译:半导体表面非平面器件二维仿真的新网格生成方法

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A general analytical method is proposed for transforming a 2-D multilayer physical domain with the nonplanar semiconductor surface into a 2-D rectangular mathematical domain with a planar surface, with a set of Fourier series being used to describe a general conformal mapping for each layer. Based on the method, a simple iteration algorithm, which incorporates a nonlinear Jacobian-iteration method with the fast Fourier transform (FFT), is developed to solve the system of nonlinear equations due to the mutually coupled boundary conditions. As a result of the analytical conformal mapping, a regular, deformable grid structure can be applied to simulate the device structure with the nonplanar semiconductor surface, and the device simulator using the conventional rectangle-based grid can be easily modified to simulate the device with the nonplanar semiconductor surface.
机译:提出了一种通用分析方法,将具有非平面半导体表面的二维多层物理域转换为具有平面的二维矩形数学域,并使用一组傅里叶级数来描述每一层的常规保形映射。 。基于该方法,开发了一种简单的迭代算法,该算法将非线性雅可比迭代方法与快速傅里叶变换(FFT)结合在一起,以解决由于相互耦合的边界条件而引起的非线性方程组。作为分析共形映射的结果,可以应用规则的,可变形的网格结构来模拟具有非平面半导体表面的器件结构,并且可以轻松修改使用常规基于矩形网格的器件仿真器以模拟具有非矩形半导体表面的器件。非平面半导体表面。

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