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Accurate Direct and Indirect On-Chip Temperature Sensing for Efficient Dynamic Thermal Management

机译:精确的直接和间接片上温度感测,实现有效的动态热管理

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摘要

Dynamic thermal management techniques require accurate runtime temperature information in order to operate effectively and efficiently. In this paper, we propose two novel solutions for accurate sensing of on-chip temperature. Our first technique is used at design time for sensor allocation and placement to minimize the number of sensors while maintaining the desired accuracy. The experimental results show that this technique can improve the efficiency and accuracy of sensor allocation and placement compared to previous work and can reduce the number of required thermal sensors by about 16% on average. Secondly, we propose indirect temperature sensing to accurately estimate the temperature at arbitrary locations on the die based on the noisy temperature readings from a limited number of sensors which are located further away from the locations of interest. Our runtime technique for temperature estimation reduces the standard deviation and maximum value of temperature estimation errors by an order of magnitude.
机译:动态热管理技术需要准确的运行时温度信息才能有效地运行。在本文中,我们提出了两种新颖的解决方案来精确检测片上温度。我们的第一种技术在设计时用于传感器的分配和放置,以最大程度地减少传感器的数量,同时保持所需的精度。实验结果表明,与以前的工作相比,该技术可以提高传感器分配和放置的效率和准确性,并且可以平均减少所需的热传感器数量约16%。其次,我们建议使用间接温度感测,以基于有限数量的传感器(距离目标位置较远)的嘈杂温度读数,准确估算出芯片上任意位置的温度。我们用于温度估算的运行时技术将温度估算误差的标准偏差和最大值降低了一个数量级。

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