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Accurate On-Chip Temperature Sensing for Multicore Processors Using Embedded Thermal Sensors

机译:使用嵌入式热传感器对多核处理器进行准确的片上温度感测

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摘要

Thermal issues seriously restrict the quality, reliability, and lifetime of semiconductor chips. To prevent thermal runaway situations, modern processors deploy numerous on-die thermal sensors to collect temperature information, which is then used to guide dynamic thermal management (DTM) mechanisms. Accurate on-chip temperature information is critical for DTM as temperature overestimation will degrade the performance by an unnecessary invocation of thermal control mechanisms, and underestimation will result in the reliability issues of the systems. In this article, two effective techniques are proposed to achieve an accurate on-chip temperature sensing. The first technique is a synergistic calibration method for forecasting the actual temperatures of noisy thermal sensors. Second, we propose a full thermal characterization technique based on convolutional neural networks (CNNs) to accurately recover the entire thermal maps by using a limited number of thermal sensors. In a realistic scenario, these two techniques can be used in combination to provide a more accurate thermal monitoring. By utilizing the sophisticated infrared imaging setup, the effectiveness of the proposed techniques is validated on a real 45-nm AMD quad-core chip. The simulation results show that the methods achieve significant improvements compared with existing techniques in the literature. The successful implementation of the proposed methods will significantly improve the efficiency of DTM.
机译:热问题严重限制半导体芯片的质量,可靠性和寿命。为了防止热失控情况,现代处理器部署了许多模具热传感器以收集温度信息,然后用于引导动态热管理(DTM)机制。对于DTM来说,精确的片上温度信息由于温度高估将通过不必要的热控制机制调用来降低性能,并且低估将导致系统的可靠性问题。在本文中,提出了两种有效的技术来实现准确的片上温度感测。第一技术是一种协同校准方法,用于预测噪声热传感器的实际温度。其次,我们提出了一种基于卷积神经网络(CNN)的全热表征技术,通过使用有限数量的热传感器来精确地恢复整个热图。在现实的场景中,这两种技术可以组合使用以提供更准确的热监测。通过利用复杂的红外成像设置,在真正的45-NM AMD四核芯片上验证了所提出的技术的有效性。仿真结果表明,与文献中的现有技术相比,该方法实现了显着的改进。成功实施拟议方法将显着提高DTM的效率。

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