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A Fast and Accurate Process Variation-Aware Modeling Technique for Resistive Bridge Defects

机译:一种快速准确的电阻桥缺陷过程变化感知建模技术

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Recent research has shown that tests generated without taking process variation into account may lead to loss of test quality. At present, there is no efficient device-level modeling technique that models the effect of process variation on resistive bridge defects. This paper presents a fast and accurate technique to achieve this, including modeling the effect of voltage and temperature variation using the BSIM4 transistor model. To speed up the computation time and without compromising simulation accuracy (achieved through BSIM4), two efficient voltage approximation algorithms are proposed for calculating logic threshold of driven gates and voltages on bridged lines of a fault-site to calculate bridge critical resistance. Experiments are conducted on a 65 nm gate library (for illustration purposes), and results show that on average the proposed modeling technique is more than 53 times faster and in the worst case, error in bridge critical resistance is 2.64% when compared with HSPICE.
机译:最近的研究表明,在不考虑过程变化的情况下生成的测试可能会导致测试质量下降。当前,尚无有效的器件级建模技术可以对工艺变化对电阻桥缺陷的影响进行建模。本文提出了一种快速而准确的技术来实现这一目标,包括使用BSIM4晶体管模型对电压和温度变化的影响进行建模。为了加快计算时间并且在不影响仿真精度的情况下(通过BSIM4实现),提出了两种有效的电压近似算法,用于计算驱动门的逻辑阈值和故障站点的桥接线上的电压,以计算桥接临界电阻。在65 nm的栅极库上进行实验(出于说明目的),结果表明,与HSPICE相比,平均而言,所提出的建模技术要快53倍以上,在最坏的情况下,电桥临界电阻的误差为2.64%。

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