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Layer Assignment of Buses and Nets With Via-Count Constraint in High-Speed PCB Designs

机译:高速PCB设计中具有通孔计数约束的总线和网络的层分配

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It is necessary for cost consideration to minimize the number of the used layers in a high-speed printed circuit board (PCB) design. In this paper, any independent net cannot be treated as a bus-oriented net in a high-speed PCB design because of no timing-matching constraint on an independent net. Any independent net in a high-speed PCB design can be modeled to obey the via-count constraint as the maximum number of the permitted vias for signal integrity. Clearly, the introduction of the permitted vias onto the independent nets can lead to the reduction on the number of the used layers in a highspeed PCB design. Given a set of bus-oriented nets and a set of independent nets with a via-count constraint in a high-speed PCB design, by introducing virtual vias onto independent nets and eliminating redundant vias on any used layer, a generalized algorithm can be proposed to minimize the number of the used layers with satisfying the via-count constraint on any independent net and assign the given bus-oriented nets and the separated segments inside the given independent nets onto the used layers. Compared with Yan's algorithm with no via introduction on independent nets, the experimental results show that our proposed algorithm with c(max) = 1, c(max) = 2, c(max) = 3, c(max) = 4, and c(max) = 5 use reasonable CPU time to insert permitted vias to reduce 2.1, 2.8, 3.8, 4.4, and 4.6 used layers on the average for ten tested examples, respectively. Compared with a two-phase algorithm with via introduction on independent nets, the experimental results show that our proposed algorithm with c(max) = 1, c(max) = 2, c(max) = 3, c(max) = 4, and c(max) = 5 use less CPU time to reduce 1.6, 1.7, 1.7, 1.6, and 1.5 used layers on the average with increasing 13.3%, 16.3%, 10.6%, 4.2%, and 2.6% of the total used vias on the independent nets for ten tested examples, respectively.
机译:出于成本考虑,必须将高速印刷电路板(PCB)设计中使用的层数降至最少。本文中,由于对独立网络没有时序匹配约束,因此在高速PCB设计中,任何独立网络都不能视为面向总线的网络。可以将高速PCB设计中的任何独立网络建模为遵循通孔计数约束,即信号完整性所允许的最大通孔数。显然,将允许的通孔引入独立的网络可以减少高速PCB设计中使用的层数。在高速PCB设计中,给定一组面向总线的网络和一组具有通孔计数约束的独立网络,通过将虚拟通孔引入独立网络并消除任何使用层上的冗余通孔,可以提出一种通用算法在满足任何独立网络上的通孔计数约束的情况下,最大程度地减少使用层的数量,并将给定的面向总线的网络以及给定的独立网络内部的分隔段分配给使用的层。与在独立网络上没有通过引入的Yan算法相比,实验结果表明,我们提出的算法c(max)= 1,c(max)= 2,c(max)= 3,c(max)= 4,并且c(max)= 5使用合理的CPU时间插入允许的过孔,以分别减少十个测试示例的平均2.1、2.8、3.8、4.4和4.6层。与通过独立网络引入的两阶段算法相比,实验结果表明,我们提出的算法c(max)= 1,c(max)= 2,c(max)= 3,c(max)= 4 ,并且c(max)= 5使用更少的CPU时间来平均减少1.6、1.7、1.7、1.6和1.5个使用的层,分别增加了总使用量的13.3%,16.3%,10.6%,4.2%和2.6%独立网络上的过孔分别用于十个测试示例。

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