首页> 外文期刊>IEEE Transactions on Circuits and Systems. I, Regular Papers >Modeling the thermal response of semiconductor devices through equivalent electrical networks
【24h】

Modeling the thermal response of semiconductor devices through equivalent electrical networks

机译:通过等效的电气网络对半导体器件的热响应进行建模

获取原文
获取原文并翻译 | 示例

摘要

The paper presents a general approach for modeling the effects of thermal response in semiconductor devices as they are seen at the electrical terminals. It is shown that this can be achieved by properly connecting at the electrical ports an equivalent electrical network representing the transformed thermal impedance. The equivalent model is employed to investigate electrothermal interactions in MOSFETs and bipolar junction transistors. Precise conditions for which electrothermal resonant oscillations arise are deduced and an experimental technique for thermal-impedance extraction is presented.
机译:本文提出了一种通用方法,用于对半导体器件中热响应的影响进行建模,就像在电端子处看到的那样。已经表明,这可以通过在电端口处适当地连接代表变换后的热阻抗的等效电网来实现。等效模型用于研究MOSFET和双极结型晶体管中的电热相互作用。推导了产生电热共振振荡的精确条件,并提出了一种用于热阻提取的实验技术。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号