首页> 外文期刊>IEEE transactions on biomedical circuits and systems >Integrated Circuits for Volumetric Ultrasound Imaging With 2-D CMUT Arrays
【24h】

Integrated Circuits for Volumetric Ultrasound Imaging With 2-D CMUT Arrays

机译:具有二维CMUT阵列的体积超声成像集成电路

获取原文
获取原文并翻译 | 示例

摘要

Real-time volumetric ultrasound imaging systems require transmit and receive circuitry to generate ultrasound beams and process received echo signals. The complexity of building such a system is high due to requirement of the front-end electronics needing to be very close to the transducer. A large number of elements also need to be interfaced to the back-end system and image processing of a large dataset could affect the imaging volume rate. In this work, we present a 3-D imaging system using capacitive micromachined ultrasonic transducer (CMUT) technology that addresses many of the challenges in building such a system. We demonstrate two approaches in integrating the transducer and the front-end electronics. The transducer is a 5-MHz CMUT array with an 8 mm$,times,$ 8 mm aperture size. The aperture consists of 1024 elements (32$,times,$32) with an element pitch of 250 $mu$ m. An integrated circuit (IC) consists of a transmit beamformer and receive circuitry to improve the noise performance of the overall system. The assembly was interfaced with an FPGA and a back-end system (comprising of a data acquisition system and PC). The FPGA provided the digital I/O signals for the IC and the back-end system was used to process the received RF echo data (from the IC) and reconstruct the volume image using a phased array imaging approach. Imaging experiments were performed using wire and spring targets, a ventricle model and a human prostrate. Real-time volumetric images were captured at 5 volumes per second and are presented in this paper.
机译:实时体超声成像系统需要发射和接收电路以产生超声束并处理接收到的回声信号。由于前端电子设备的需求必须非常靠近传感器,因此构建此类系统的复杂性很高。还需要将大量元素连接到后端系统,并且大数据集的图像处理可能会影响成像体积率。在这项工作中,我们提出了一种使用电容性微机械超声换能器(CMUT)技术的3D成像系统,该系统解决了构建此类系统中的许多挑战。我们演示了集成换能器和前端电子设备的两种方法。该换能器是一个5MHz CMUT阵列,孔径为8毫米×8毫米。孔径由1024个元素(32 $,times,$ 32)组成,元素间距为250 $ mu $ m。集成电路(IC)由发射波束形成器和接收电路组成,以改善整个系统的噪声性能。该组件与一个FPGA和一个后端系统(包括数据采集系统和PC)接口。 FPGA为IC提供了数字I / O信号,后端系统用于处理从IC接收到的RF回波数据,并使用相控阵成像方法重建体图像。使用金属丝和弹簧靶,心室模型和人类前列腺进行了成像实验。实时体积图像以每秒5个体积的速度捕获,并在本文中进行介绍。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号