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30-W/mm GaN HEMTs by Field Plate Optimization

机译:通过场板优化实现30W / mm GaN HEMT

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摘要

GaN high-electron-mobility-transistors (HEMTs) on SiC were fabricated with field plates of various dimensions for optimum performance. Great enhancement in radio frequency (RF) current-voltage swings was achieved with acceptable compromise in gain, through both reduction in the trapping effect and increase in breakdown voltages. When biased at 120 V, a continuous wave output power density of 32.2 W/mm and power-added efficiency (PAE) of 54.8% at 4 GHz were obtained using devices with dimensions of 0.55×246μm{sup}2 and a field-plate length of 1.1μm. Devices with a shorter field plate of 0.9μm also generated 30.6 W/mm with 49.6% PAE at 8 GHz. Such ultrahigh power densities are a dramatic improvement over the 10-12 W/mm values attained by conventional gate GaN-based HEMTs.
机译:用各种尺寸的场板制造SiC上的GaN高电子迁移率晶体管(HEMT),以获得最佳性能。通过减少陷获效应和增加击穿电压,可以大大提高射频(RF)电流-电压摆幅,并获得可接受的增益折衷。当偏置电压为120 V时,使用尺寸为0.55×246μm{sup} 2的器件和一块场板,在4 GHz时可获得32.2 W / mm的连续波输出功率密度和54.8%的功率附加效率(PAE)。长度为1.1μm。场板更短(0.9μm)的设备在8 GHz时产生的功率为30.6 W / mm,PAE为49.6%。与传统的基于GaN的HEMT相比,这种超高功率密度是10-12 W / mm值的显着改善。

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