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10 W/mm and High PAE Field-plated AlGaN/GaN HEMTs at Ka-band with n+GaN Source Contact Ledge

机译:10个W / mm和高PAE镀普拉根螺纹/ GaN Hemts,KA波段,N + GaN源触点壁架

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Continuous progress in wide bandgap GaN/AlGaN-based HEMTs since 1993 [1] has pushed its frequency performance beyond X-band into millimeter-wave range. In particular, there has been growing interest of wide bandgap semiconductors for K-, Ka-, Q, and W-band [2] applications. While the early performances in these bands was obtained from GaN/AlGaN HEMTs fabricated with T-gates, recently demonstrated field-plated (FP) AlGaN/GaN-based HEMTs have shown dramatically improved RF power performance, where the FP devices were fabricated with reduced gate capacitance. Field-plated GaN/AlGaN HEMTs with deep-submicron gatelengths offered excellent large-signal performance with power density of 5.7 W/mm and PAE of 45% at 30 GHz [3]. At 40 GHz, the CW power density of 10.5 W/mm was measured with PAE of 34% [4]. The FP devices appear to enable reliable long-term operation. While the large-signal performance of AlGaN/GaN HEMTs is improved in the FP devices, their PAE, power density and linearity can be further improved if their high 2DEG sheet resistance, non-linearity in transconducance, access resistance and saturation velocity are addressed properly in device design.
机译:自1993自1993年以来,宽带隙GaN / Algan的HEMTS在宽带隙GaN / Algan的悬臂上的持续进展推动了其频率性能,超越X波段至毫米波范围。特别是,对于K-,Ka-,Q和W波段的宽带隙半导体已经越来越感兴趣。虽然这些带中的早期性能是由用T型栅极制成的GaN / AlGaN的HEMT获得,但最近显示出现场镀(FP)AlGaN / GaN的HEMT显示出显着改善的RF功率性能,其中FP器件减少制造栅极电容。具有深亚微米的GaN / AlGaN Hemts具有深层亚微米的GATELENGS,提供优异的大信号性能,功率密度为5.7W / mm,PAE为30 GHz [3]。在40 GHz,用PAE为34%[4]测量10.5W / mm的CW功率密度。 FP设备似乎可以启用可靠的长期操作。虽然AlGaN / GaN Hemts的大信号性能在FP设备中得到改善,但如果它们的高2deg薄层电阻,非线性在经沟道,进入电阻和饱和速度的高度线性,则可以进一步提高它们的PAE,功率密度和线性。在设备设计中。

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