Quality investigation of joint of bipolar transistor chip and leadframe by thermal wave method

Suszynski Z.

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Quality investigation of joint of bipolar transistor chip and leadframe by thermal wave method

机译：热波法研究双极晶体管芯片与引线框架的接合质量

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A nondestructive control method of bipolar transistor chipnsoldering to the lead frame based on the thermal wave method isndescribed. The quality of the joint is determined from the phasencharacteristics of the chip's thermal transmittance

机译：描述了基于热波方法的双极型晶体管芯片焊接到引线框架的非破坏性控制方法。接头的质量取决于芯片的导热率的相位特性

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《IEE proceedings. Part G, Circuits, devices and systems》 |1997年第2期|p.78-80|共3页
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Suszynski Z.;
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正文语种 eng
中图分类基本电子电路;电工技术;计量学;
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1. Quality investigation of joint of bipolar transistor chip and lead frame by thermal wave method [J] . Suszynski Z. IEE proceedings. Part G . 1997,第2期

机译：热波法研究双极晶体管芯片与引线框架的接合质量
2. Quality investigation of joint of bipolar transistor chip and lead frame by thermal wave method [J] . Z. Suszybski IEE proceedings. Part G . 1997,第2期

机译：热波法研究双极晶体管芯片与引线框架的接合质量
3. Microwave and thermal characteristics of backside-connected flip-chip power heterojunction bipolar transistors [J] . Pin-Fan Chen, Johnson R.A. Electronics Letters . 1996,第20期

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4. Numerical Investigation on Infrared Thermal Wave Detection Method Used for The Coated Bonding Quality of Different Materials in Solid Rocket Motors [C] . Qi Chen, Shipeng Li, Xin Sui, AIAA/SAE/ASEE joint propulsion conference;AIAA propulsion and energy forum . 2018

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5. Thermal -structural optimization and reliability of leadframe solder joint geometry in electronic packaging [D] . Nelson-Owusu, Kofi 2000

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6. Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips [O] . Chaoqun Jiao, Zuoming Zhang, Zhibin Zhao, 2020

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7. Electro-Thermal modelling of very High power Microwave bipolar Junction transistors [O] . Fagan Christopher J., Snowden Christopher M. 2001

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Quality investigation of joint of bipolar transistor chip and leadframe by thermal wave method

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