Fuzzy thermal placement for multichip module applications

摘要

This paper presents an algorithm based on the fuzzy logic approach for the placement of the power dissipating chips on the multichip module substrate. In the conventional force-directed placement method, the forces are related to the number of connection among the modules. However, unlike the conventional force-directed placement method, the fuzzy approach is used to model the force interaction among the chips in our placement method. The force interaction and the distance between two chips are chosen as linguistic variables.