Real-time observation of thermally induced warpage of flip-chip package using far-infrared Fizeau interferometry

摘要

Far-infrared Fizeau interferometry is implemented for real-time observation of the thermally induced warpage of flip-chip packages. The basic principles of the method and the mechanical design of an instrument are reviewed. The configuration is ideal for real-time observation of the thermally induced warpage of flip-chip electronic packages. The experimental results are presented for two analyses, and their implications on the design of flip-chip packages are discussed.