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DEVELOPMENT OF MOIRÉ INTERFEROMETRY FOR REAL-TIME OBSERVATION OF NONLINEAR THERMAL DEFORMATIONS OF SOLDER AND SOLDER ASSEMBLY

机译:MOIRÉ干涉测量技术用于实时观测焊剂和焊剂组件的非线性热变形

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摘要

An experimental apparatus using moiré interferometry is developed to characterize the thermo-mechanical behavior of solder joints. A compact moiré interferometer is combined with an environmental chamber to allow real-time observation of non-linear and time-dependent solder and solder assemblies. The first apparatus is based on convection heating and cooling to simulate an accelerated thermal cycling (ATC) condition. Vibrations caused by an environmental chamber are circumvented by unique rigid links that connect the specimen to the moiré interferometer. Displacement fields are documented while the chamber is being operated. The system is utilized to analyze thermo-mechanical behavior of a ceramic ball grid array package assembly and a plastic ball grid array package assembly. The effect of thermal cycling on the accumulated permanent deformation is documented, which reveals the temperature-dependent non-linearity of solder joints.The second apparatus is based on conduction heating and cooling to achieve a high ramp rate. A special chamber is designed and fabricated using a high power thermoelectric cooler to achieve the desired ramp rate. The system is utilized to investigate the time-dependent behavior of solder joints. A new solder joint configuration is designed and fabricated to be tested with the conduction based apparatus. The specimen is an extension of the conventional bi-material joint configuration but the unique design offers two important features; it negates the inherent shortcoming from cross sectioning required in moiré interferometry and produces a virtually uniform shear strain field at the solder joint. The deformation of solder joint is documented at a controlled ramp rate over several thermal cycles. The experimental results are analyzed and compared with those of Finite Element analysis to investigate the validity of solder constitutive models available in the literatures.
机译:开发了一种使用莫尔干涉仪的实验设备,以表征焊点的热机械行为。紧凑的莫尔干涉仪与环境室结合在一起,可以实时观察非线性和时间相关的焊料和焊料组件。第一装置基于对流加热和冷却以模拟加速的热循环(ATC)条件。将样品连接到莫尔干涉仪的独特刚性连接件可避免环境室引起的振动。在操作腔室时记录位移场。该系统用于分析陶瓷球栅阵列包装组件和塑料球栅阵列包装组件的热机械行为。记录了热循环对累积永久变形的影响,揭示了焊点的温度依赖性非线性。第二种设备基于传导加热和冷却,以实现较高的升温速率。使用大功率热电冷却器设计和制造一个特殊的腔室,以达到所需的升温速率。该系统用于调查焊点随时间变化的行为。设计并制造了一种新的焊点配置,可以使用基于导电的设备进行测试。该标本是常规双材料接头配置的扩展,但独特的设计具有两个重要特征:它消除了莫尔干涉测量法所需的横截面所固有的缺点,并在焊点处产生了几乎均匀的剪切应变场。在几个热循环中以受控的斜率记录了焊点的变形。对实验结果进行分析,并与有限元分析的结果进行比较,以研究文献中可用的焊料本构模型的有效性。

著录项

  • 作者

    Cho Seungmin;

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  • 年度 2005
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  • 原文格式 PDF
  • 正文语种 en_US
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