CVD low-k for 90nm processing

摘要

The european semiconductor equipment assessment (SEA) initiative provides a unique opportunity for equipment manufactures to take new technology innovations to market. Stmicroelectronics' action (advanced cvd tool foi integration of organosilicate nanoporous films) project aims to address both the transition to 300mm wafer sizes and the strategically important introduction of cvd ultra low-k materials into 90nm copper interconnects. UK semiconductor equipment supplier trikon technologies aims to take part. Trikon's Andy noakes writes.