Toppan Printing develops next-generation EUV photomask

摘要

Toppan printing has announced that it has developed a next-generation EUV photomask for leading-edge semiconductors. The new photomask minimizes the unwanted reflection of light to peripheral sections during EUV exposure, a next-generation semiconductor manufacturing technology. Testing using EUV exposure machinery manufactured by ASML has verified that this new EUV photomask can reduce dimension variability on silicon substrates by two-thirds.