Indium Corporation featured precision gold-tin (AuSn) solder preforms for die-attach which are designed for high-reliability applications, such as aerospace, defense, and medical. Gold-based solder has a high melting point, ranging from 280 ℃ to 1064℃ (depending on the alloy), making it compatible with subsequent reflow processes. This alloy has the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. In addition, gold-based solders are resistant to corrosion, provide superior thermal fatigue resistance, and exhibit excellent joint strength. The company's Pb-free and RoHS-compliant AuSn preforms are available in a variety of standard and custom-engineered designs. The precision manufacturing processes and technologies ensure repeatable success in a production process. In addition, the partners with die-bonding equipment manufacturers to ensure that its preforms are engineered to work with equipment from assembly through reflow.
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