GOLD-TIN SOLDER SUITABLE FOR SELF-ALIGNING APPLICATIONS

摘要

A tin-rich gold-tin solder is disclosed which is particularly advantageousfor self-aligning applications. When utilized with gold-plated bond locations, theout-diffusion of tin from the solder during heating functions to shift the compositionof the remaining solder closer to the eutectic value, thus preserving the liquid state ofthe solder and improving its reflow quality with respect to conventional eutecticsolders.