首页> 外文期刊>Electronics Letters >Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems
【24h】

Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems

机译:用于大型纳米光子学的系统的自对准硅中介层和硅桥

获取原文
获取原文并翻译 | 示例
           

摘要

A two-and-a-half-dimensional (2.5D) platform for enabling silicon nano-photonics and dense electrical interconnections between interposers in a tile-like configuration is presented. Three 20 x 20 mm silicon interposer tiles are assembled directly on an FR4 printed wiring board (PWB), and two 6 x 20 mm silicon bridges are assembled on top of the interposer tiles. Accurate alignment of interposer tiles to bridges, an important metric in enabling highly efficient optical coupling, is provided using positive self-alignment structures (PSASs). It is demonstrated that by using PSAS on two silicon substrates, sub-micron alignment between substrates is possible; in the cascaded configuration involving FR4, <5 ;C;m alignment accuracy is obtained. In addition, electrical interconnection via a bridge using mechanically flexible interconnects (MFIs) is demonstrated, which made non-bonding interconnections from one interposer tile to another via a silicon bridge, allowing silicon bridges as well as the interposer tiles to be replaced. Total silicon interposer area available is 960 mm2.
机译:提出了一种二维半(2.5D)平台,用于实现硅纳米光子学和中介层之间的瓦片状配置中的密集电互连。将三个20 x 20 mm的硅中介层砖直接组装在FR4印刷电路板(PWB)上,两个6 x 20 mm的硅桥被组装在中介层砖的顶部。使用正向自对准结构(PSAS),可提供中介层到桥的精确对准,这是实现高效光耦合的重要指标。结果表明,通过在两个硅基板上使用PSAS,基板之间的亚微米对准是可能的。在涉及FR4的级联配置中,获得<5; C; m的对准精度。此外,还演示了使用机械柔性互连(MFI)通过电桥进行的电互连,该电互连通过硅桥实现了从一个中介层到另一个中介层的非粘结互连,从而可以替换硅桥和中介层。可用的硅中介层总面积为960 mm 2

著录项

  • 来源
    《Electronics Letters》 |2014年第20期|1475-1477|共3页
  • 作者

    Yang H.S.; Zhang C.; Bakir M.S.;

  • 作者单位

    School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, USA;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号