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CHIP PACKAGE STRUCTURE USING SILICON INTERPOSER AS INTERCONNECTION BRIDGE
CHIP PACKAGE STRUCTURE USING SILICON INTERPOSER AS INTERCONNECTION BRIDGE
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机译:芯片包装结构使用硅插入器作为互连桥
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摘要
A chip package structure using silicon interposer as interconnection bridge lifts multi-dies above the fan-out molding package embedded with premade Si interposer interconnection bridge under the multi-die space. The interconnection bridge connects the multi-dies through fine pitch high I/O interconnection. A first RDL and a second RDL are further disposed on top side and bottom side of the fan-out molding package, further providing connection for the multi-dies to a substrate via the connection routing inside the fan-out molding package.
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