首页> 美国卫生研究院文献>Scientific Reports >Efficient Cross-talk Reduction of Nanophotonic Circuits Enabled by Fabrication Friendly Periodic Silicon Strip Arrays
【2h】

Efficient Cross-talk Reduction of Nanophotonic Circuits Enabled by Fabrication Friendly Periodic Silicon Strip Arrays

机译:通过制造友好的周期性硅条阵列实现纳米光子电路的有效串扰减少

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

Reduction of the crosstalk between adjacent photonic components has been regarded as one of the most effective, yet most challenging approaches for increasing the packing density of photonic integrated circuits. Recently, extensive efforts have been devoted to this field, leading to a number of elaborate designs, such as waveguide supperlattice and nanophotonic cloaking, among others. Here we develop a simple and efficient crosstalk reduction approach for silicon-based nanophotonic circuits by introducing a periodic array of silicon strips between adjacent waveguides. Studies indicate that the coupling lengths can be extended by more than two orders of magnitude for a waveguide pair with an edge-to-edge distance of ~λ/3 at the telecommunication wavelength. Further investigations reveal that our method is effective for both strongly and weakly confined silicon photonic modes, and works well over a broad band of operational wavelengths. In addition, the crosstalk reduction technique is shown to be capable of improving the coupling lengths of other elements as well, such as vertical silicon slot waveguides. Our approach offers a promising platform for creating ultra-compact functional components that is fabrication friendly, thereby providing a feasible route toward the realization of photonic integrated circuits with ultra-high packing densities.
机译:减少相邻光子组件之间的串扰已被视为增加光子集成电路的封装密度的最有效但最具挑战性的方法之一。近来,已经在该领域上进行了广泛的努力,从而导致了许多精心设计,例如波导超晶格和纳米光子掩盖。在这里,我们通过在相邻波导之间引入硅带的周期性阵列,为基于硅的纳米光子电路开发了一种简单有效的串扰降低方法。研究表明,对于在电信波长下边到边距离约为λ/ 3的波导对,耦合长度可以扩展两个以上的数量级。进一步的研究表明,我们的方法对于强和弱约束硅光子模式均有效,并且在较宽的工作波长范围内都能很好地工作。此外,显示出降低串扰的技术还能够改善其他元件的耦合长度,例如垂直硅缝隙波导。我们的方法提供了一个有前途的平台,用于创建易于制造的超紧凑功能组件,从而为实现具有超高封装密度的光子集成电路提供了一条可行的途径。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号