Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection

摘要

This paper reports novel interconnect technologies to enable a large scale ‘interposer tile’ and ‘silicon bridge’ interconnection platform. Microfabricated self-alignment structures enable high alignment accuracy between the components. Mechanically flexible interconnects (MFIs) are utilized to enable rematable electrical interconnects. Moreover, a proof of concept demonstration with interposer tiles directly mounted on FR4 board and interconnected by silicon bridges is reported.