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Reflow Technology Ready for Lead-free Challenge

机译:回流技术已准备好应对无铅挑战

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摘要

With the spotlight on lead-free solder, oven capabilities are coming under tight scrutiny. But, just where does this really fit into the full reflow picture? Are there equally important issues pushing oven developments? As new capabilities are unveiled, what is being done to help existing customers optimize older ovens? To clarify these issues, seven major oven manufacturers agreed to share their opinions, strategies and latest equipment developments with EP&P.
机译:随着人们对无铅焊料的关注,对烤箱的性能也受到了严格的审查。但是,这到底在什么地方适合整个回流焊图?是否有同样重要的问题推动烤箱的发展?随着新功能的推出,如何做以帮助现有客户优化旧烤箱?为了澄清这些问题,七个主要的烤箱制造商同意与EP&P分享他们的观点,策略和最新设备开发。

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