Developing Solder Stencils for CSP

摘要

Chip scale BGA packaging is emerging as one of the most significant advances in electronics manufacturing since the introduction of surface mount technology. Providing a small-yet-reliable form factor, CSP holds the solution for future generations of hand-held and portable product applications. It may, at some point, even replace the lead-frame packaged IC (fig. 1). As electronic product size continues to shrink, designers who adapt the higher I/O chip-scale (or fine pitch) BGA will look toward PCB suppliers for practical and economical solutions.